Exhibition Introduction

• electronica China is one of the most influential events in the electronics industry, with more than 20 years of history.
• The exhibition has become a leading platform for showcasing future electronic innovations, advanced technologies, and industry collaboration.
• It brings together global experts, manufacturers, and technology providers to drive the development of the electronics ecosystem.

Technology Breakthrough

• Industry-first Mobile Vision Alignment System integrated with upper and lower prism optics.
• Simultaneous image acquisition of both screen stencil patterns and wafer alignment marks.

Key Features

• Rapid Alignment: Reduces setup time from approximately 30 minutes to just 3 minutes, significantly improving productivity and minimizing pre-printing preparation.
• Vision Registration: Accurately detects fine wafer fiducial marks, eliminating manual trial-and-error alignment while improving both efficiency and print quality.
• Dual-Purpose Processing: Supports protective material printing and trench filling on bare dies, replacing conventional spin-coating and photolithography processes to reduce manufacturing costs.
• Enables solder paste printing directly on die bonding pads, allowing subsequent gold or aluminum wire bonding to establish reliable electrical connections between the chip and external leads.

Featured Machines

ATMA-SW12
Wafer Vision Alignment Screen Printer

• Suitable for 6–12 inch wafers.
• Supports protective coatings, solder paste, flux printing, and ball placement processes.
• Applicable to LTCC/HTCC multilayer ceramics and various ceramic substrates.
• Designed for fine silver/carbon circuitry, via filling, embedded passive components, and ultra-high precision screen printing applications requiring exceptional registration accuracy and film thickness control.

ATMAOE 56
High-Precision Screen Printer for Optoelectronic Applications

• Designed for front-side and back-side protective coating applications.
• Suitable for photoresist printing and advanced FOPLP (Fan-Out Panel Level Packaging) processes.
• Ideal for large-area substrate coating, insulation layer printing, and other high-precision semiconductor printing applications.