Screen Printing Machine is used to print solder mask, legend, wet-film plug-via process to make PCB

ATMA screen printing machine for PCB application

ATMA screen printing machine for PCB application

PCB Screen Printing Machine

Screen Printing Machine is used to print solder mask, legend, wet-film plug-via process to make PCB

Circuit printing is primarily applied in electronic circuit boards and advanced packaging processes. Through high-precision screen printing, uniform and stable functional patterns can be formed on substrate surfaces, including conductive, insulating, solder mask, and other functional ink layers.
This process features high-accuracy alignment, high yield, and stable mass production capability, and is widely used in advanced industries such as artificial intelligence (AI), high-performance computing, telecommunications, and automotive electronics

★★★ Categories of circuit screen printing processes

1. PCB circuit screen printing
▲Multiple Layer PCB
▲High Layer Count Circuit (HLC)
▲AI Servo Motherboard
▲AI Accelerator Card
▲High-speed Transmission Board

Process requirements
High-precision registration, fine-line printing, and stable ink control.

Key requirements
High repeatability accuracy, uniform ink layer thickness, and stable mass production process.

2. HDI / SLP Substrate Printing
▲HDI High Density Interconnection
▲ SLP Substrate-like PCB
▲Advanced Smart Phone Motherboard

Process requirements
Fine-pitch pattern printing, high-precision registration, and low defect rate

Key requirements
High-resolution printing capability, stable yield and precise positioning control

3. Functional Electronics Printing
▲Conductive Silver Paste Printing
▲Sensor Circuit Printing
▲Flexible Printed Circuit (FPC)
▲RF and Antenna Circuit Printing

Process requirements
High conductivity, fine-line printing, high-resolution printing capability, strong adhesion, and environmental reliability.

Key requirements
High conductivity, fine-line printing, reliability, and environmental durability.

★★★ Mass production process challenges

1. Difficulty in High-precision Registration
Customer Challenges:
HDI, SLP, and high multilayer PCBs have high circuit density, while traditional printing equipment lacks sufficient registration accuracy, which can easily lead to pad misalignment, poor opening quality, or short-circuit risks.

Technical Solution:
Introduce a high-resolution CCD vision registration system, utilizing dual cameras to simultaneously recognize positioning marks and the screen, combined with a high-precision servo platform for automatic compensation and fine adjustment.
Integrating a high-rigidity mechanical structure with a precision guide rail system ensures platform motion accuracy and repeatable positioning capability

Tangible Benefits:
 ▲ Enhance printing registration accuracy.
 ▲ Reduce circuit misalignment and short-circuit risks.
 ▲Improve overall yield and process consistency

2.Uneven ink film thickness affects quality
Customer Challenges:
Non-uniform thickness of solder mask ink or conductive paste can easily cause unstable conductivity, insufficient coverage, or appearance defects.

Technical Solution:
By adopting a high-rigidity printing platform and a precision squeegee pressure control system, with servo-controlled squeegee speed and printing pressure, uniform ink deposition is ensured.
The printing head structure provides multi-axis fine adjustment mechanisms for squeegee angle, pressure, and depth, enabling adaptation to different ink viscosities and screen tension conditions.

Tangible Benefits:
 ▲ More uniform layer thickness distribution.
 ▲ Improved conductivity and insulation layer quality.
 ▲ Reduced rework and scrap.

3. Insufficient process stability in advanced PCB manufacturing.
Customer Challenges:
For AI server boards and high multilayer PCB, the long process time means that if equipment precision is insufficient, prolonged production can easily result in misalignment and quality fluctuations.

Technical Solution:
The equipment adopts a high-rigidity welded steel structure with precision-machined reference surfaces, combined with high-accuracy linear guide rails and a servo drive system. Through stable mechanical construction and transmission design, long-term operation can still maintain positioning accuracy

Tangible Benefits:
 ▲ Maintain stable quality during long-term mass production.
 ▲Reduce process fluctuations.
 ▲ Enhance reliability of advanced products

4. Lengthy changeover and machine setup time
Customer Challenges:
In a multi-product manufacturing environment, lengthy equipment adjustment time reduces overall production line efficiency.

Technical Solution:
Digital process management with recipe memory enables storage of multiple printing parameter sets covering squeegee speed, pressure, platform positioning, and registration, ensuring fast changeover and consistent production quality.
User-friendly HMI enables rapid operation, significantly reducing changeover and setup time to improve production efficiency

Tangible Benefits:
 ▲Significantly shortened changeover time.
 ▲Improved equipment utilization rate.
 ▲Increased production line flexibility.

5. Unstable quality in micro-via hole plugging
Customer Challenges:
In HDI and high-density PCB micro-vias are small with high aspect ratios. If via plugging is incomplete or bubbles remain, voids can form in the holes, leading to subsequent electroplating issues and reduced circuit reliability

Technical Solution:
By adopting high-pressure precision via plugging technology, with stable pressure control and a precise squeegee mechanism, ink is uniformly filled into micro-vias.
With precise registration and a stable platform, the hole positions are ensured to fully correspond with the screen mesh openings

Tangible Benefits:
 ▲Improved completeness of plug-via.
 ▲Reduced bubbles and void defects.
 ▲Enhanced yield and product reliability in subsequent processes.

6. Difficulty in double-sided solder mask registration
Customer Challenges:
Double-sided solder mask printing requires precise registration with pads and circuits. If registration errors are too large, it can easily cause poor pad coverage or window misplacement

Technical Solution:
By introducing a high-precision CCD visual registration system, automatic recognition of positioning marks and screen alignment compensation is achieved for double-sided printing. Combined with a high-accuracy printing platform and stable pressure control, ensure printing positions precision.

Tangible Benefitss:
 ▲Improved solder mask registration accuracy.
 ▲Reduced pad contamination and short-circuit risk.
 ▲ Enhanced overall product yield.


Flexible circuits are typically manufactured using a polyimide (Kapton) material and one to multiple layers of copper. The copper foil was processed by etching treatment to emerge fine line circuits, legend (or marks), and solder mask is printed afterward. ATMA provides two solutions for printing solder mask, legend (or marks), silver and carbon paste onto flexible PCB like flatbed and roll-to-roll screen printing as stated below :

1.ATMA flatbed screen printer is suitable for printing sheet by sheet to continue processing after upstream image exposure and etching process. Since ATMA flatbed screen printer has the vacuum tabletop which is machined to achieve high accuracy of flatness and is equipped with the adjustable features for printing to attain even ink layer thickness, and the delicate fine line of legend (or marks) is printed on top of solder mask as well. The optional unloading device can be added to upgrade as 3/4 automatic to save labor increasing production efficiency.

2.ATMA roll-to-roll screen printer is suitable for high productivity printing the coiled flexible foils to continue processing after upstream image exposure and etching process. This screen printer is equipped with a high-resolution CCD camera to achieve accuracy registering and is incorporated with a drying section to meet high production efficiency.

PCB Screen Printing Machine

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PCB Screen Printing Machine | ATMA

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